Pulling solder balls from substrates to measure adhesion between die solder balls and substrate, to assess the ability of solder balls to withstand mechanical shear, possibly the role of components in manufacturing, handling, inspection, shipping and end use force. Ideal for testing glue, solder and sintered silver bond areas. Solder ball shear test, also known as bond strength test. According to the tested solder balls/chips, a rigid and precise push tool fixture is selected, and the test head is moved to the rear and top of the tested product through the three-axis test platform, so that the cutting tool and the chip surface are at 90 degree ±5 degree . and aligned with the solder ball bump/chip under test. A sensitive touchdown function was used to find the surface of the test substrate. At the same time, the position of the cutting tool is kept accurate, that is, according to the movement rate set by the device program, the cutting is performed at the same height every time. Equipped with a regularly calibrated sensor, (the sensor is selected to exceed 1.1 times the maximum shear force of the solder ball), high-power optics, and a stable dual-arm microscope to assist. A camera system is also available for loading tool and weld alignment, post-test inspection, failure analysis and video capture. Test modules for different applications can be easily replaced. Many functions are automated, along with advanced electronics and software controls. Mainly based on JEDEC JESD22-B116 - Gold Ball Shearing, JEDEC JESD22-B117 - Solder Ball Shearing, ASTM F1269 - Ball Bond Shearing, Chip Shearing -MIL STD 883 and other related industry standards. The test range of the push ball test can be selected from 250G or 5KG; the chip or CHIP thrust test range can be tested to 0-100kg; 0-200KG is more common. The working principle is also applicable to gold balls, copper balls, solder balls, wafers, chips, SMD components, chips, IC packages, solder joints, solder pastes, smt patches, SMD capacitors, and 0402/0603 components Thrust shear test equipment.
Prinsip Fungsi Tarik Bola Solder / chip
Feb 02, 2021
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